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MIC8115 74LVT 00BZI 133AC 805SF DD311 MBZ5222B MN6220
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 MOSFET MODULE
FEATURES
* Trench Gate MOS FET Module
Single 800A /150V
OUTLINE DRAWING
PHM8001
* Super Low Rds(ON) 1.4 milliohms( @800A ) * With Fast Recovery Source-Drain Diode
Circuit
TYPICAL APPLICATIONS
* Chopper Control For FORKLIFTs
MAXMUM RATINGS Ratings
Drain-Source Voltage (VGS=0V) Gate - Source Voltage Continuous Drain Current Duty=50% D.C.
Approximate Weight : 650g
Symbol
VDSS VGSS ID IDM PD Tjw Tstg VISO FTOR M4 M8
PHM8001
150 +/ - 20 800 (Tc=25C) 640 (Tc=25C) 1,600 Tc=25C) 2,650 Tc=25C) -40 to +150 -40 to +125 2,500 3.0 1.4 10.5
Unit
V V A A W C C V N*m
Pulsed Drain Current Total Power Dissipation Operating Junction Temperature Range Storage Temperature Range Isolation Voltage Terminals to Base AC, 1 min.) Module Base to Heatsink Mounting Torque Gate Terminals Bus Bar to Main Terminals
ELECTRICAL CHARACTERISTICS (@Tc=25C unless otherwise noted) Characteristic Symbol Test Condition
Zero Gate Voltage Drain Current Gate-Source Leakage Current Gate-Source Threshold Voltage Static Drain-Source On-Resistance Drain-Source On-Voltage Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Rise Time Turn-On Delay Time Fall Time Turn-Off Delay Time IDSS IGSS VGS(th) rDS(on) VDS(on) gfs Cies Coss Crss tr td(on) VDS=VDSS,VGS=0V VGS=+/- 20V,VDS=0V VDS=VGS, ID=16mA VGS=10V, ID=800A VGS=10V, ID=800A VDS=15V, ID=800A VDS=10V,VGS=0V,f=1MHz VDD= 80V ID=400A VGS= -5V, +10V RG= 0.75 ohm
Min.
1.0 -
Typ.
2.0 1.15 1.10 165 20 20 500 880 180 1,300
Max.
4.8 4.8 3.2 1.4 1.25 -
Unit mA A V m-ohm V S nF nF nF ns
tf
td(off)
FREE WHEELING DIODES RATINGS & CHARACTERISTICS (Tc=25C) Characteristic Symbol Test Condition
Continuous Source Current Pulsed Source Current Diode Forward Voltage Reverse Recovery Time IS ISM VSD trr Duty=50%. D.C. (Terminal Temperature=80C IS=800A IS=800A, -dis/dt=1,600A/s
Min.
-
Typ.
1.10 130
Max.
800 650 1,600 1.76 -
Unit A A V ns Unit C/W
THERMAL CHRACTERISTICS Characteristic
Thermal Resistance, Junction to Case Thermal Resistance, Case to Heatsink
Symbol
Rth(j-c) Rth(c-f)
Test Condition
Mounting surface flat, smooth, and greased
Min.
-
Typ.
-
Max.
0.047 0.035
PHM8001
OUTLINE DRAWING (Dimensions in mm)
Fig.1- Output Characteristics (Typical)
1600 1400 1200
Fig.2- Drain to Source On Voltage vs. Gate to Source Voltage (Typical)
TC=25
2 1.8
VGE=10V 8V
4V 3V
250s PULSE TEST
TC=25 250s PULSE TEST
Drain to Source Voltage V DS (V)
1.6 1.4 1.2 1 0.8 0.6 0.4 0.2
DrainCurrent I D (A)
1000 800 600 400 200
ID=800A
ID=400A ID=200A
2V
00 0.5 1 1.5 2 2.5 3 3.5 4
0
0
2
4
6
8
10
12
14
16
Drain to Source Voltage VDS (V)
Gate to Source Voltage VGS (V)
Fig.3- Drain to Source On Voltage vs. Junction Temperature (Typical)
2.5
Fig.4- Capacitance vs. Drain to Source Voltage (Typical)
200000 175000 150000
VGS=10V 250s PULSE TEST
Ciss
VGS=0V f=1MHZ TC=25
Drain to Source Voltage V DS (V)
2
Capacitance C (nF)
125000 100000 75000
ID=800A
1.5
1
ID=400A
Coss
50000
Crss
0.5
ID=200A
25000 0
0.5
1
2
5
10
20
50
80
0 -50
0
50
100
150
Drain to Source Voltage VDS (V)
Junction Temperature Tj ()
Fig.5- Gate Charge vs. Gate to Source Voltage (Typical)
16
Fig.6- Series Gate Impedance vs. Switching Time (Typical)
100 50
ID=800A VDD=20V
14
VDD=40V VDD=80V
20
VDD=80V ID=400A TC=25
Gate to Source Voltage V GS (V)
Switching Time t (s)
12 10 8 6 4 2 00
10 5 2 1
td(off) tr
0.5
td(on)
0.2
tf
1000 2000 3000 4000 5000 6000 7000 0.1 0.5 1 2 5 10 20 50 100 200
Total Gate Charge Qg (nC)
Series Gate Impedance RG ()
Fig.7- Drain Current vs. Switching Time (Typical)
1.2
Fig.8- Source to Drain Diode Forward Characteristics (Typical)
1600
1
VDD=80V RG=0.75 TC=25
TJ=125
TJ=25
1400 1200
Switching Time t (s)
0.8
Source Current I S (A)
td(off)
1000 800 600 400 200
0.6
0.4
td(on)
0.2
tr
tf
0
0
200
400
600
800
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Drain Current ID (A)
Source to Drain Voltage VSD (V)
Fig.9- Reverse Recovery Characteristics (Typical)
500
Peak Reverse Recovery Current I RrM (A) Reverse Recovery Time trr (ns)
-IS=800A TJ=125
200
trr
100
50
IRrM
20
10 0 500 1000 1500 2000 2500
-di/dt (A/s)
Fig.10- Maximun Transient Thermal Impedance
1x10 -1
(/W)
Transient Thermal Impedance Rth
(J-C)
3x10 -2
1x10 -2
3x10 -3
1x10 -3 -5 10
10 -4
10 -3
10 -2
10 -1
1
10 1
SQUARE WAVE PULSE DURATION t (s)


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